| apu3c4 |
System board |
| Status |
active |
| Part numbers |
apu3c2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM
apu3c4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM
apu3b2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM
apu3b4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded)
apu3a2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu3a4 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded) |
| Application |
This board version is targeted at applications that require 2 3G / LTE modems. SIM sockets can be swapped under GPIO control, enabling failover between two different networks even when only one modem is used. Another feature is the build option for a regular PCI express slot on the side. |
| Use with |
case1d2blku enclosures
ac12veur2 AC adapter
msata16g mSATA SSD
wle200nx miniPCI express wireless module |
| Specification |
- CPU: AMD Embedded G series GX-412TC, 1 GHz quad Jaguar core with 64 bit and AES-NI support, 32K data + 32K instruction cache per core, shared 2MB L2 cache.
- DRAM: 2 or 4 GB DDR3-1333 DRAM
- Storage: Boot from SD card (internal sdhci controller), external USB or m-SATA SSD. 1 SATA + power connector. mSATA is shared with miniPCI express.
- 12V DC, about 6 to 12W depending on CPU load. Jack = 2.5 mm, center positive
- Connectivity: 3 Gigabit Ethernet channels (Intel i211AT)
- I/O: DB9 serial port, 2 USB 3.0 external + 4 USB 2.0 internal, three front panel LEDs, pushbutton
- Expansion: 3 miniPCI express (J14 USB or mSATA, with SIM; J15 USB only, with SIM; J16: full miniPCI express, but no SIM, intended for wifi). GPIO header, optional I2C bus, COM2 (3.3V RXD / TXD).
- Board size: 6 x 6″ (152.4 x 152.4 mm) – same as apu1d, alix2d13 and wrap1e.
- Firmware: coreboot (please contact support@pcengines.ch for source code if desired).
- Cooling: Conductive cooling from the CPU to the enclosure using a 3 mm alu heat spreader (included).
|
| OEM options |
PCI express slot on the side, different number of LAN ports, etc. |
| Documentation |
user’s manual |
| Howto |
HowTo collection |
| Cooling assembly |
apu cooling assembly instructions |
| Version apu3c: |
- Improve compatibility with LTE modem modules: Disconnect SMB_DAT / SMB_CLK signals (1.8V level on Quectel).
- Improve compatibility with LTE modem modules: No stuff diodes D4 / D17, option resistor bypass (extremely low VIL on Huawei modems, sensitive to incoming EMI).
- Optional SIM presence indicator / SIM card detect.
- Disable non-functional NCT5104D watchdog timer.
- Increase 3.3V current limit to allow for two simultaneous LTE modems.
- Some DFM changes.
|
| Version apu3b: |
Fixed USB header J13 pinout. |
| Version apu3a: |
The pinout on USB header J13 is wrong, do not use. |
| BIOS update |
Please see Howto collection for instructions on BIOS upgrade.
Update 3/2017: various fixes, enable additional USB ports, iPXE with setup, set SIM switch GPIO to high.
|
| Schematic |
apu3a / apu3b / apu3c schematics, |
| Manufacturer |
PC Engines |
| Origin |
Taiwan |
